Analyzing and understanding the acoustics is key
At Ole Wolff we offer to set up an acoustic simulation network of our customers actual application containing all the elements in the transducer as well as in the Head-& Earphone design, which will influence on the sound performance. These are expressed as the TS parameters.
Using this setup we can quite accurately predict the sound performance and match this to our customers wishes.
Usually we share these networks with customers as well, so we can run parallel simulations at both parties for best cooperation.
When getting closer to the actual mechanical design target of the Head or Earphone project involved, we perform a 3D simulation based on Comsol, which comes even closer to the real live audio performance to be expected.
This step gives our customers even more confidence in the design phase leading to a short and cost effective development cycle.
Very often both 2D and 3D simulations are used to simulate the influence of leakage holes, front- and rear cavities etc.